Selective Laser Sintering - Sls Stereo Light Curing Molding - Sla
It mainly uses photosensitive resin as a raw material, and utilizes the characteristic that liquid photosensitive resin will cure quickly under ultraviolet laser beam irradiation. The photosensitive resin is generally liquid, and it immediately initiates a polymerization reaction and completes curing when irradiated with a certain wavelength of ultraviolet light (250 nm to 400 nm). SLA focuses on the surface of the light-curing material by focusing ultraviolet light of a specific wavelength and intensity to solidify it sequentially from point to line and from line to surface, thereby completing the drawing of a layered cross-section.
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Congratulations on the Successful Development of PCBWay's 24-Layer, 6-Order Arbitrary Interconnection HDI PCB
With the ongoing advancements in the integrated circuit industry, the complexity of connections between chips has grown exponentially. Traditional PCB technologies face significant limitations when dealing with higher-frequency and faster-speed requirements. Ensuring stable and reliable connections between high-speed and high-density chips has become crucial.
In addition, as chip power consumption continues to rise, so does the heat generated, necessitating efficient cooling solutions to maintain normal chip operations. As a result, a new type of PCB called the interposer PCB has emerged.
The so-called interposer PCB is a highly precise, high-layer arbitrary interconnection HDI PCB. It serves as a vital component for connecting and integrating different electronic parts and acts as an intermediary layer for chip connections. It achieves electrical connections through pad leads and interconnects with the chip’s micro bumps (uBump) and the routing in the intermediary layer. The intermediary layer uses through-silicon vias (TSV) to connect upper and lower layers.
This PCB's design features inner layers connected to the outer layers through laser microvias and dense routing, resulting in a multi-structured board with BGA connections on the top side and pad connections on the bottom side.
Interposer PCBs hold immense value and importance in improving various aspects of integrated circuit performance. First, they offer higher connection speeds and reliability for semiconductor products. Made from high-performance materials, interposer PCBs enable short-distance, high-density connections between integrated circuits, significantly increasing chip data transmission rates.
Secondly, interposer PCB technology addresses signal integrity and power consumption issues. By utilizing interposer technology, signal pins can be directly connected to the interposer layer, reducing the length of signal transmission paths, thus minimizing signal loss and enhancing signal integrity.
Thirdly, the interposer layer also plays a thermal management role, effectively reducing chip temperatures. Finally, interposer PCB technology facilitates the connection between heterogeneous integrated circuits. By placing integrated circuits with different functionalities on the same interposer layer, it enables interconnections between various chips, thereby boosting the overall performance and efficiency of semiconductor products.
Interposer PCBs are widely used in high-performance computing, artificial intelligence, data centers, and communications. In high-performance computing systems, interposer technology connects multiple processing chips, enabling larger-scale computing capabilities. In the field of artificial intelligence, interposer technology facilitates interconnections between different chips, enhancing the training and inference speeds of neural networks. In data center and communication applications, interposer technology offers higher transmission rates and bandwidth to meet the demands of big data processing and high-speed communication.
As a leading manufacturer of high-end HDI PCBs, PCBWay stays ahead of market trends. In response to the urgent demand from clients for high-order arbitrary interconnection (Anylayer) HDI boards, our product research institute has tackled technical challenges, successfully developing high-layer, high-order arbitrary interconnection interposer PCBs.
Let’s take the 24-layer, 6-order Anylayer HDI PCB as an example to showcase the details of this high-precision circuit product.
Product Parameters:
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Product Structure:
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Technical Challenges:
Challenge 1: The buried via PCB thickness from L7 to L18 is 1.0 mm, with a mechanical through-hole diameter of 0.1 mm, resulting in a hole aspect ratio of 10:1, making mechanical drilling challenging.
Challenge 2: The BGA pitch is 0.35 mm, and the distance from the hole to the conductor trace is 0.13 mm, which increases the risk of misalignment during multiple laminations.
Challenge 3: The trace width/spacing is 2.4/3 mil, featuring dense routing. Below are some routing diagrams:
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Finished Product Pictures:
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In conclusion, interposer PCBs play a pivotal role in advancing the performance of integrated circuits across various industries. They ensure reliable connections, enhance signal integrity, manage thermal issues, and facilitate heterogeneous integration. With their versatility and efficiency, interposer PCBs continue to push the boundaries of modern electronics.